常見的半導體材料有矽、鍺、砷化鎵等
/
晶片測試
晶片處理高度有序化的本質增加了對不同處理步驟之間度量方法的需求。晶片測試度量裝置被用於檢驗晶片仍然完好且沒有被前面的處理步驟損壞。如果If the number of dies—the 積體電路s that will eventually become chips—當一塊晶片測量失敗次數超過一個預先設定的閾值時，晶片將被廢棄而非繼續後續的處理製程。
/
晶片測試
晶片處理高度有序化的本質增加了對不同處理步驟之間度量方法的需求。晶片測試度量裝置被用於檢驗晶片仍然完好且沒有被前面的處理步驟損壞。如果If the number of dies—the 積體電路s that will eventually become chips—當一塊晶片測量失敗次數超過一個預先設定的閾值時，晶片將被廢棄而非繼續後續的處理製程。
Device yield or die yield is the number of working chips or dies on a wafer, given in percentage since the number of chips on a wafer (Die per wafer, DPW) can vary depending on the chips' size and the wafer's diameter. Yield degradation is a reduction in yield, which historically was mainly caused by dust particles, however since the 1990s, yield degradation is mainly caused by process variation, the process itself and by the tools used in chip manufacturing, although dust still remains a problem in many older fabs. Dust particles have an increasing effect on yield as feature sizes are shrunk with newer processes. Automation and the use of mini environments inside of production equipment, FOUPs and SMIFs have enabled a reduction in defects caused by dust particles. Device yield must be kept high to reduce the selling price of the working chips since working chips have to pay for those chips that failed, and to reduce the cost of wafer processing. Yield can also be affected by the design and operation of the fab.
Tight control over contaminants and the production process are necessary to increase yield. Contaminants may be chemical contaminants or be dust particles. "Killer defects" are those caused by dust particles that cause complete failure of the device (such as a transistor). There are also harmless defects. A particle needs to be 1/5 the size of a feature to cause a killer defect. So if a feature is 100 nm across, a particle only needs to be 20 nm across to cause a killer defect. Electrostatic electricity can also affect yield adversely. Chemical contaminants or impurities include heavy metals such as Iron, Copper, Nickel, Zinc, Chromium, Gold, Mercury and Silver, alkali metals such as Sodium, Potassium and Lithium, and elements such as Aluminum, Magnesium, Calcium, Chlorine, Sulfur, Carbon, and Fluorine. It is important for those elements to not remain in contact with the silicon, as they could reduce yield. Chemical mixtures may be used to remove those elements from the silicon; different mixtures are effective against different elements.
Several models are used to estimate yield. Those are Murphy's model, Poisson's model, the binomial model, Moore's model and Seeds' model. There is no universal model; a model has to be chosen based on actual yield distribution (the location of defective chips) For example, Murphy's model assumes that yield loss occurs more at the edges of the wafer (non-working chips are concentrated on the edges of the wafer), Poisson's model assumes that defective dies are spread relatively evenly across the wafer, and Seeds's model assumes that defective dies are clustered together.[25]
Smaller dies cost less to produce (since more fit on a wafer, and wafers are processed and priced as a whole), and can help achieve higher yields since smaller dies have a lower chance of having a defect. However, smaller dies require smaller features to achieve the same functions of larger dies or surpass them, and smaller features require reduced process variation and increased purity (reduced contamination) to maintain high yields. Metrology tools are used to inspect the wafers during the production process and predict yield, so wafers predicted to have too many defects may be scrapped to save on processing costs.[26]
刑警guest刑警2021/07/13 09:25
葉青峻~你幹嘛留言~你是狗是不是?我喝醉了~
Manifestations
There are many observable physical phenomena that arise in interactions involving virtual particles. For bosonic particles that exhibit rest mass when they are free and actual, virtual interactions are characterized by the relatively short range of the force interaction produced by particle exchange. Confinement can lead to a short range, too. Examples of such short-range interactions are the strong and weak forces, and their associated field bosons.
For the gravitational and electromagnetic forces, the zero rest-mass of the associated boson particle permits long-range forces to be mediated by virtual particles. However, in the case of photons, power and information transfer by virtual particles is a relatively short-range phenomenon (existing only within a few wavelengths of the field-disturbance, which carries information or transferred power), as for example seen in the characteristically short range of inductive and capacitative effects in the near field zone of coils and antennas.
Some field interactions which may be seen in terms of virtual particles are:
The Coulomb force (static electric force) between electric charges. It is caused by the exchange of virtual photons. In symmetric 3-dimensional space this exchange results in the inverse square law for electric force. Since the photon has no mass, the coulomb potential has an infinite range.
The magnetic field between magnetic dipoles. It is caused by the exchange of virtual photons. In symmetric 3-dimensional space, this exchange results in the inverse cube law for magnetic force. Since the photon has no mass, the magnetic potential has an infinite range.
Electromagnetic induction. This phenomenon transfers energy to and from a magnetic coil via a changing (electro)magnetic field.
The strong nuclear force between quarks is the result of interaction of virtual gluons. The residual of this force outside of quark triplets (neutron and proton) holds neutrons and protons together in nuclei, and is due to virtual mesons such as the pi meson and rho meson.
The weak nuclear force is the result of exchange by virtual W and Z bosons.
The spontaneous emission of a photon during the decay of an excited atom or excited nucleus; such a decay is prohibited by ordinary quantum mechanics and requires the quantization of the electromagnetic field for its explanation.
The Casimir effect, where the ground state of the quantized electromagnetic field causes attraction between a pair of electrically neutral metal plates.
The van der Waals force, which is partly due to the Casimir effect between two atoms.
Vacuum polarization, which involves pair production or the decay of the vacuum, which is the spontaneous production of particle-antiparticle pairs (such as electron-positron).
Lamb shift of positions of atomic levels.
The Impedance of free space, which defines the ratio between the electric field strength |E| and the magnetic field strength |H |: Z0 = | E|⁄|H|.[8]
Much of the so-called near-field of radio antennas, where the magnetic and electric effects of the changing current in the antenna wire and the charge effects of the wire's capacitive charge may be (and usually are) important contributors to the total EM field close to the source, but both of which effects are dipole effects that decay with increasing distance from the antenna much more quickly than do the influence of "conventional" electromagnetic waves that are "far" from the source.[a] These far-field waves, for which E is (in the limit of long distance) equal to cB, are composed of actual photons. Actual and virtual photons are mixed near an antenna, with the virtual photons responsible only for the "extra" magnetic-inductive and transient electric-dipole effects, which cause any imbalance between E and cB. As distance from the antenna grows, the near-field effects (as dipole fields) die out more quickly, and only the "radiative" effects that are due to actual photons remain as important effects. Although virtual effects extend to infinity, they drop off in field strength as 1⁄r2 rather than the field of EM waves composed of actual photons, which drop 1⁄r.[b][c]
Most of these have analogous effects in solid-state physics; indeed, one can often gain a better intuitive understanding by examining these cases. In semiconductors, the roles of electrons, positrons and photons in field theory are replaced by electrons in the conduction band, holes in the valence band, and phonons or vibrations of the crystal lattice. A virtual particle is in a virtual state where the probability amplitude is not conserved. Examples of macroscopic virtual phonons, photons, and electrons in the case of the tunneling process were presented by Günter Nimtz[9] and Alfons A. Stahlhofen.[10]
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謝謝老大阿已經跟我朋友玩過了~~~完全改善我知前那附:)))) 謝謝太感恩了XDDD
To MuchaMaksim: 很高興你喜歡^^
常見的半導體材料有矽、鍺、砷化鎵等
/
晶片測試
晶片處理高度有序化的本質增加了對不同處理步驟之間度量方法的需求。晶片測試度量裝置被用於檢驗晶片仍然完好且沒有被前面的處理步驟損壞。如果If the number of dies—the 積體電路s that will eventually become chips—當一塊晶片測量失敗次數超過一個預先設定的閾值時，晶片將被廢棄而非繼續後續的處理製程。
/
晶片測試
晶片處理高度有序化的本質增加了對不同處理步驟之間度量方法的需求。晶片測試度量裝置被用於檢驗晶片仍然完好且沒有被前面的處理步驟損壞。如果If the number of dies—the 積體電路s that will eventually become chips—當一塊晶片測量失敗次數超過一個預先設定的閾值時，晶片將被廢棄而非繼續後續的處理製程。
/
步驟列表
晶片處理
濕洗
平版照相術
光刻Litho
離子移植IMP
蝕刻（干法蝕刻、濕法蝕刻、電漿蝕刻）
熱處理
快速熱退火Annel
熔爐退火
熱氧化
化學氣相沉積 (CVD)
物理氣相沉積 (PVD)
分子束磊晶 (MBE)
電化學沉積 (ECD)，見電鍍
化學機械平坦化 (CMP)
IC Assembly and Testing 封裝測試
Wafer Testing 晶片測試
Visual Inspection外觀檢測
Wafer Probing電性測試
FrontEnd 封裝前段
Wafer BackGrinding 晶背研磨
Wafer Mount晶圓附膜
Wafer Sawing晶圓切割
Die attachment上片覆晶
Wire bonding焊線
BackEnd 封裝後段
Molding模壓
Post Mold Cure後固化
De-Junk 去節
Plating 電鍍
Marking 列印
Trimform 成形
Lead Scan 檢腳
Final Test 終測
Electrical Test電性測試
Visual Inspection光學測試
Baking 烘烤
/
有害材料標誌
許多有毒材料在製造過程中被使用。這些包括：
有毒元素摻雜物比如砷、硼、銻和磷
有毒化合物比如砷化三氫、磷化氫和矽烷
易反應液體、例如過氧化氫、發煙硝酸、硫酸以及氫氟酸
工人直接暴露在這些有毒物質下是致命的。通常IC製造業高度自動化能幫助降低暴露於這一類物品的風險。
/
Device yield
Device yield or die yield is the number of working chips or dies on a wafer, given in percentage since the number of chips on a wafer (Die per wafer, DPW) can vary depending on the chips' size and the wafer's diameter. Yield degradation is a reduction in yield, which historically was mainly caused by dust particles, however since the 1990s, yield degradation is mainly caused by process variation, the process itself and by the tools used in chip manufacturing, although dust still remains a problem in many older fabs. Dust particles have an increasing effect on yield as feature sizes are shrunk with newer processes. Automation and the use of mini environments inside of production equipment, FOUPs and SMIFs have enabled a reduction in defects caused by dust particles. Device yield must be kept high to reduce the selling price of the working chips since working chips have to pay for those chips that failed, and to reduce the cost of wafer processing. Yield can also be affected by the design and operation of the fab.
Tight control over contaminants and the production process are necessary to increase yield. Contaminants may be chemical contaminants or be dust particles. "Killer defects" are those caused by dust particles that cause complete failure of the device (such as a transistor). There are also harmless defects. A particle needs to be 1/5 the size of a feature to cause a killer defect. So if a feature is 100 nm across, a particle only needs to be 20 nm across to cause a killer defect. Electrostatic electricity can also affect yield adversely. Chemical contaminants or impurities include heavy metals such as Iron, Copper, Nickel, Zinc, Chromium, Gold, Mercury and Silver, alkali metals such as Sodium, Potassium and Lithium, and elements such as Aluminum, Magnesium, Calcium, Chlorine, Sulfur, Carbon, and Fluorine. It is important for those elements to not remain in contact with the silicon, as they could reduce yield. Chemical mixtures may be used to remove those elements from the silicon; different mixtures are effective against different elements.
Several models are used to estimate yield. Those are Murphy's model, Poisson's model, the binomial model, Moore's model and Seeds' model. There is no universal model; a model has to be chosen based on actual yield distribution (the location of defective chips) For example, Murphy's model assumes that yield loss occurs more at the edges of the wafer (non-working chips are concentrated on the edges of the wafer), Poisson's model assumes that defective dies are spread relatively evenly across the wafer, and Seeds's model assumes that defective dies are clustered together.[25]
Smaller dies cost less to produce (since more fit on a wafer, and wafers are processed and priced as a whole), and can help achieve higher yields since smaller dies have a lower chance of having a defect. However, smaller dies require smaller features to achieve the same functions of larger dies or surpass them, and smaller features require reduced process variation and increased purity (reduced contamination) to maintain high yields. Metrology tools are used to inspect the wafers during the production process and predict yield, so wafers predicted to have too many defects may be scrapped to save on processing costs.[26]
葉青峻~你幹嘛留言~你是狗是不是?我喝醉了~
Manifestations
There are many observable physical phenomena that arise in interactions involving virtual particles. For bosonic particles that exhibit rest mass when they are free and actual, virtual interactions are characterized by the relatively short range of the force interaction produced by particle exchange. Confinement can lead to a short range, too. Examples of such short-range interactions are the strong and weak forces, and their associated field bosons.
For the gravitational and electromagnetic forces, the zero rest-mass of the associated boson particle permits long-range forces to be mediated by virtual particles. However, in the case of photons, power and information transfer by virtual particles is a relatively short-range phenomenon (existing only within a few wavelengths of the field-disturbance, which carries information or transferred power), as for example seen in the characteristically short range of inductive and capacitative effects in the near field zone of coils and antennas.
Some field interactions which may be seen in terms of virtual particles are:
The Coulomb force (static electric force) between electric charges. It is caused by the exchange of virtual photons. In symmetric 3-dimensional space this exchange results in the inverse square law for electric force. Since the photon has no mass, the coulomb potential has an infinite range.
The magnetic field between magnetic dipoles. It is caused by the exchange of virtual photons. In symmetric 3-dimensional space, this exchange results in the inverse cube law for magnetic force. Since the photon has no mass, the magnetic potential has an infinite range.
Electromagnetic induction. This phenomenon transfers energy to and from a magnetic coil via a changing (electro)magnetic field.
The strong nuclear force between quarks is the result of interaction of virtual gluons. The residual of this force outside of quark triplets (neutron and proton) holds neutrons and protons together in nuclei, and is due to virtual mesons such as the pi meson and rho meson.
The weak nuclear force is the result of exchange by virtual W and Z bosons.
The spontaneous emission of a photon during the decay of an excited atom or excited nucleus; such a decay is prohibited by ordinary quantum mechanics and requires the quantization of the electromagnetic field for its explanation.
The Casimir effect, where the ground state of the quantized electromagnetic field causes attraction between a pair of electrically neutral metal plates.
The van der Waals force, which is partly due to the Casimir effect between two atoms.
Vacuum polarization, which involves pair production or the decay of the vacuum, which is the spontaneous production of particle-antiparticle pairs (such as electron-positron).
Lamb shift of positions of atomic levels.
The Impedance of free space, which defines the ratio between the electric field strength |E| and the magnetic field strength |H |: Z0 = | E|⁄|H|.[8]
Much of the so-called near-field of radio antennas, where the magnetic and electric effects of the changing current in the antenna wire and the charge effects of the wire's capacitive charge may be (and usually are) important contributors to the total EM field close to the source, but both of which effects are dipole effects that decay with increasing distance from the antenna much more quickly than do the influence of "conventional" electromagnetic waves that are "far" from the source.[a] These far-field waves, for which E is (in the limit of long distance) equal to cB, are composed of actual photons. Actual and virtual photons are mixed near an antenna, with the virtual photons responsible only for the "extra" magnetic-inductive and transient electric-dipole effects, which cause any imbalance between E and cB. As distance from the antenna grows, the near-field effects (as dipole fields) die out more quickly, and only the "radiative" effects that are due to actual photons remain as important effects. Although virtual effects extend to infinity, they drop off in field strength as 1⁄r2 rather than the field of EM waves composed of actual photons, which drop 1⁄r.[b][c]
Most of these have analogous effects in solid-state physics; indeed, one can often gain a better intuitive understanding by examining these cases. In semiconductors, the roles of electrons, positrons and photons in field theory are replaced by electrons in the conduction band, holes in the valence band, and phonons or vibrations of the crystal lattice. A virtual particle is in a virtual state where the probability amplitude is not conserved. Examples of macroscopic virtual phonons, photons, and electrons in the case of the tunneling process were presented by Günter Nimtz[9] and Alfons A. Stahlhofen.[10]
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